Hong Kong TIPTOP Technology Co., Ltd. is a leading international trade service provider specializing in the sales of high-end Chinese manufacturing machines. With over 20 years of experience in machine design, manufacturing, and global distribution, we are dedicated to delivering factory-direct solutions for the LCD display and 3C electronics industries. As a National High-Tech Enterprise certified with ISO9001 and ISO 14001, we ensure quality and environmental excellence. Our core competencies lie in prioritizing efficiency, innovation, and sustainability, helping clients enhance productivity while minimizing operational costs. In line with this mission, TIPTOP is also in charge of the commercialization of SUNSOM products, further strengthening our commitment to providing comprehensive and innovative market solutions.
The lamination of touch panel films primarily involves two processes: films lamination and Vacuum Defoamer.
In a compelling example of operational efficiency and sustainability, a municipal wastewater treatment plant recently reported a 25% reduction in annual operating costs after integrating the OLB FOG Bond Machine into its fat, oil, and grease (FOG) management system. This case study highlights the transformative impact of advanced waste processing technologies on both economic and environmental performance.
For products with a diagonal size of less than 75mm, use a vacuum pen for loading and unloading. For products with a diagonal size greater than 75mm, manual loading and unloading is allowed, but touching the terminals is prohibited.
In a significant advancement for waste management and sustainable energy, OLB has unveiled its latest innovation—the FOG Bond Machine—designed to dramatically improve the processing of fats, oils, and grease (FOG). This cutting-edge technology has demonstrated a remarkable 30% increase in grease waste conversion rate, positioning OLB as a leader in efficient and eco-friendly waste treatment solutions.
FOG is a processing method that achieves mechanical connection and electrical conduction between liquid crystal glass and flexible printed circuits through ACF, along with hot pressing under specific temperature, pressure, and duration.
To meet various functional demands in the market, there are manual bonding, automatic bonding, single-station bonding, dual-station bonding, and heated bonding options. So, how should we make the right choice?